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Notícias

Successful Development of a High-Temperature Superconducting Magnet for Next-Generation Flywheels

18/03/2014

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The Railway Technical Research Institute (hereinafter called “RTRI”) and Furukawa Electric Co., Ltd. (hereinafter called “Furukawa Electric”) have been the first in the world to succeed at the development of a high-temperature superconducting magnet for large flywheels, using the second generation high-temperature superconducting wires manufactured by SuperPower Inc., a subsidiary of Furukawa Electric.(note 1)

This development is being carried out in cooperation with Kubotek Corporation, Mirapro Co., Ltd. and the Public Enterprise Bureau of Yamanashi Prefecture, as part of the project for the “Development of Technology for Safe, Low-cost, Large-size Battery Systems” being promoted by the New Energy and Industrial Technology Development Organization.

 

Summary of development results

 

  • We succeeded in the development of a high-strength high-temperature superconducting magnet by using second generation high-temperature superconducting wires(note 2) that use yttrium.
  • It was demonstrated that a load exceeding 2 tons can be supported without contact when this magnet is cooled to 50K (minus 223°C) and a high magnetic field is generated.
  • This makes it possible to operate at 50K (minus 223°C), which is a temperature considerably higher than with the conventional high-temperature superconducting coils that are cooled to 20K (minus 253°C). We therefore have the prospect of being able to reduce cooling costs.

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KANZACC Composite Plating Suitable for Lead Frames for Semiconductor Equipment and/or Electronic Components is Developed

18/03/2014

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KANZACC Co., Ltd. (Head office: Osaka City, President: Hisakazu Ishibashi) of the Furukawa Electric Group (hereinafter referred to as "our company") has developed composite plating with good heat resistance and good crack resistance as well. It is suitable for plating lead frames for semiconductor equipment and/or electronic components.

Semiconductor equipment and/or electronic components are created by covering each component on the lead frame with epoxy resin, etc. Especially, for the surface implementation type, the tip of the lead frame is bent in an L shape to make it easy to solder it to the circuit board. Also, the lead frame material is iron and/or copper alloy, and it is not possible to solder it as it is. Therefore, we plate it with tin and/or tin alloy (hereinafter referred to as "tin (alloy) plating"). In this case, it is a common practice to plate it with tin (alloy) after plating the substrate on the lead frame.

 

Read more at: http://www.furukawa.co.jp/english/what/2014/ene_140307.htm

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Furukawa, OFS and Corning Achieve Milestone for Optical Interconnect

18/03/2014

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OFC/NFOEC 2014, Booth 4153, San Francisco, California, March 5, 2014 – Furukawa Electric Co., Ltd. has developed a vertical cavity surface emitting laser (VCSEL) that operates at 25Gbps and realized transmission of up to 500 meters over prototype multimode fibers developed by OFS and Corning Incorporated (NYSE:GLW). 

“This is a significant accomplishment for data communications as both longer reaches and higher speeds are required for warehouse-scale data centers.  Our customers are raising expectations as they implement next-generation data centers and we are pleased to be innovating the technology to meet and exceed those expectations,” said Dr. Haruki Ogoshi, senior fellow of Furukawa.

The rapid growth of cloud computing and expansion of “big data” is causing a dramatic increase in the volume of data handled in data centers. This has generated demand for greater throughput in servers, switches and routers in data centers.  Increasing the serial speed of transmission of lasers and photo detectors is one approach to that end. In addition, there is a need to increase transmission distances between devices as data centers become larger. In mega data centers, for example, transmission distances of 300m or longer can be required. At present, VCSELs at a wavelength of 850nm are widely used for lowest cost optical interconnect.  However, it is known that when the transmission speed is changed from 10Gbps to higher-speed 25Gbps, the transmission distance is limited to less than   200m due to the influence of chromatic dispersion in multimode fibers.

 

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Establishment of New Istanbul Representative Office in Republic of Turkey

18/03/2014

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Furukawa Electric Europe Ltd. (“FEEL”), a subsidiary of Furukawa Electric Co., Ltd., has opened a representative office in Istanbul with the aim of expanding its business region into the Turkish domestic market and the regions of Eastern Europe, Central Asia, the Middle East and North Africa.

The opening of the new representative office is part of a series of activities aimed at building a platform for sustainable growth (“Growth”) by expanding business in the infrastructure and automotive markets and bolstering the Group’s global management, as set out in the Furukawa “G” plan 2015 (medium-term management plan to 2015).

 

Read more at: http://www.furukawa.co.jp/english/what/2014/kei_140226.htm

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Fujitsu Laboratories and Furukawa Electric Develop Low-Cost Multi-Fiber Optical Connector

18/03/2014

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Kawasaki and Tokyo, Japan, February 3, 2014 - Fujitsu Laboratories Ltd. and Furukawa Electric Co., Ltd. today announced that they have collaborated to develop a new multi-fiber optical connector that enjoins and aligns multiple optical fibers for optical interconnects (note 1) -

The conventional method of connecting optical fibers requires high-precision polishing that aligns the tips of the fibers, making the cost of this process considerable. Fujitsu Laboratories and Furukawa Electric have developed a connector that can accommodate different lengths of optical fiber with a spring mechanism that obviates the need for this polishing process, slashing by more than half the cost required to connect optical fibers.

This new jointly developed connector achieves performance on par with conventional connectors while simplifying the task of installing high-capacity optical interconnects in a server. It is anticipated that this technology will increase data transmission speed between boards, increasing overall server performance.

This technology is being presented in detail at SPIE Photonics West 2014, from February 1, 2014, in San Francisco.

Read more at: http://www.furukawa.co.jp/english/what/2014/kenkai_140203.htm

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